Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System: Fid-Bau Portal

Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System

S. Murakami, M. O. / Kajihara, M.

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Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System

S. Murakami, M. O. / Kajihara, M.

Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System

S. Murakami, M. O. / Kajihara, M.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System

Contributors:

S. Murakami, M. O. (author) / Kajihara, M. (author)

Published in:

Materials transactions ; 59 ; 198-203

Publication date:

2018-01-01

Size:

6 pages

ISSN:

1345-9678

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105

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