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Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System
Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System
Growth Behavior of Compounds during Reactive Diffusion in the Solid-Cu/Liquid-Sn System
S. Murakami, M. O. (Autor:in) / Kajihara, M. (Autor:in)
Materials transactions ; 59 ; 198-203
01.01.2018
6 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.1105
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