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A platform for research: civil engineering, architecture and urbanism
Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
Effect of Abrasive Particle Size on Lapping of Sapphire Wafer by Fixed Abrasive Pad
Wang, J. B. (author) / Li, Z. (author) / Zhu, Y. W. (author) / Jiang, B. C. (author) / Shi, P. C. (author)
Key engineering materials ; 764 ; 106-114
2018-01-01
9 pages
Article (Journal)
English
DDC:
620.1105
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