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    Printable optically transparent adhesive processing for bonding of LED chips to packages

    New search for: Shih, Yu-Chou
    New search for: Kim, Gunwoo
    New search for: You, Jiun-Pyng
    New search for: Shi, Frank G.

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    Printable optically transparent adhesive processing for bonding of LED chips to packages

    New search for: Shih, Yu-Chou
    New search for: Kim, Gunwoo
    New search for: You, Jiun-Pyng
    New search for: Shi, Frank G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Printable optically transparent adhesive processing for bonding of LED chips to packages

    New search for: Shih, Yu-Chou
    New search for: Kim, Gunwoo
    New search for: You, Jiun-Pyng
    New search for: Shi, Frank G.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Printable optically transparent adhesive processing for bonding of LED chips to packages

    Contributors:

    Shih, Yu-Chou (author) / Kim, Gunwoo (author) / You, Jiun-Pyng (author) / Shi, Frank G. (author)

    Published in:

    Materials science in semiconductor processing ; 56 ; 155-159

    Publication date:

    2016-01-01

    Size:

    5 pages

    ISSN:

    1369-8001

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  621.38152

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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