Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish: Fid-Bau Portal

Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Tseng, C. F. / Lee, T. K. / Ramakrishna, G. / Liu, K. C. / Duh, J. G.

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Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Tseng, C. F. / Lee, T. K. / Ramakrishna, G. / Liu, K. C. / Duh, J. G.

Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Tseng, C. F. / Lee, T. K. / Ramakrishna, G. / Liu, K. C. / Duh, J. G.

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Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Suppressing Ni3Sn4 formation in the Sn-Ag-Cu solder joints with Ni-P/Pd/Au surface finish

Contributors:

Tseng, C. F. (author) / Lee, T. K. (author) / Ramakrishna, G. (author) / Liu, K. C. (author) / Duh, J. G. (author)

Published in:

MATERIALS LETTERS ; 65 ; 3216-3218

Publication date:

2011-01-01

Size:

3 pages

ISSN:

0167-577X

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.1105 / 530

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