A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Chen, Sung-Te (author) / Chung, Yu-Cheng (author) / Fang, Jau-Shiung (author) / Cheng, Yi-Lung (author) / Chen, Giin-Shan (author)
Applied surface science ; 405 ; 350-358
2017-01-01
9 pages
Article (Journal)
English
DDC:
620.44
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