Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Enhancement of seeding for electroless Cu plating of metallic barrier layers by using alkyl self-assembled monolayers
Chen, Sung-Te (Autor:in) / Chung, Yu-Cheng (Autor:in) / Fang, Jau-Shiung (Autor:in) / Cheng, Yi-Lung (Autor:in) / Chen, Giin-Shan (Autor:in)
Applied surface science ; 405 ; 350-358
01.01.2017
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.44
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