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    Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

    New search for: Wang, Yuechun
    New search for: Chen, Xiuhua
    New search for: Ma, Wenhui
    New search for: Shang, Yudong
    New search for: Lei, Zhengtao
    New search for: Xiang, Fuwei

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    Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

    New search for: Wang, Yuechun
    New search for: Chen, Xiuhua
    New search for: Ma, Wenhui
    New search for: Shang, Yudong
    New search for: Lei, Zhengtao
    New search for: Xiang, Fuwei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

    New search for: Wang, Yuechun
    New search for: Chen, Xiuhua
    New search for: Ma, Wenhui
    New search for: Shang, Yudong
    New search for: Lei, Zhengtao
    New search for: Xiang, Fuwei

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

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    Document information
    Title:

    Electroless deposition of NiCrB diffusion barrier layer film for ULSI-Cu metallization

    Contributors:

    Wang, Yuechun (author) / Chen, Xiuhua (author) / Ma, Wenhui (author) / Shang, Yudong (author) / Lei, Zhengtao (author) / Xiang, Fuwei (author)

    Published in:

    Applied surface science ; 396 ; 333-338

    Publication date:

    2017-01-01

    Size:

    6 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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