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Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Mostafa Shalaby, Rizk (author) / Kamal, Mustafa (author) / Ali, Esmail A.M. (author) / Gumaan, Mohammed S. (author)
MATERIALS SCIENCE AND ENGINEERING A ; 690 ; 446-452
2017-01-01
7 pages
Article (Journal)
Unknown
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