Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Microstructural and mechanical characterization of melt spun process Sn-3.5Ag and Sn-3.5Ag-xCu lead-free solders for low cost electronic assembly
Mostafa Shalaby, Rizk (Autor:in) / Kamal, Mustafa (Autor:in) / Ali, Esmail A.M. (Autor:in) / Gumaan, Mohammed S. (Autor:in)
MATERIALS SCIENCE AND ENGINEERING A ; 690 ; 446-452
01.01.2017
7 pages
Aufsatz (Zeitschrift)
Unbekannt
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Tensile Properties of Sn-3.5Ag and Sn-3.5Ag-0.75Cu Lead-free Solders
| British Library Online Contents | 2002
Mechanical properties evolution of Sn-3.5Ag based lead-free solders by nanoindentation
| British Library Online Contents | 2006
Micromechanical Responses of Sn-3.5Ag-xCo Lead-Free Solders by Nanoindentation
| British Library Online Contents | 2008
Impression creep characterization of rapidly cooled Sn-3.5Ag solders
| British Library Online Contents | 2004
| British Library Online Contents | 2005