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Effect of thermal misfit stress on steam-driven delamination in electronic packages

Zhang, Xian / Meng, Haoran / Wang, Hehui / Guo, Fenglin

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Effect of thermal misfit stress on steam-driven delamination in electronic packages

Zhang, Xian / Meng, Haoran / Wang, Hehui / Guo, Fenglin

Effect of thermal misfit stress on steam-driven delamination in electronic packages

Zhang, Xian / Meng, Haoran / Wang, Hehui / Guo, Fenglin

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Effect of thermal misfit stress on steam-driven delamination in electronic packages

Contributors:

Zhang, Xian (author) / Meng, Haoran (author) / Wang, Hehui (author) / Guo, Fenglin (author)

Published in:

Engineering fracture mechanics ; 194 ; 61-72

Publication date:

2018-01-01

Size:

12 pages

ISSN:

0013-7944

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.112605

British Library Online Contents | 2015

Peer review report 3 on "An analytical study on steam-driven delamination and stability of delamination growth in electronic packages"

British Library Online Contents | 2015

Peer review report 2 on "An analytical study on steam-driven delamination and stability of delamination growth in electronic packages"

British Library Online Contents | 2015

Effect of thermal misfit stress on crack deflection at planar interfaces in layered systems

Lee, W. / Myoung, J. M. / Yoo, Y. H. et al. | British Library Online Contents | 2006

Straight-sided, buckling-driven delamination of thin films at high stress levels

Jensen, H. M. / Sheinman, I. | British Library Online Contents | 2001