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    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    New search for: Xu, Yongchao
    New search for: Lu, Jing
    New search for: Xu, Xipeng

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    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    New search for: Xu, Yongchao
    New search for: Lu, Jing
    New search for: Xu, Xipeng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    New search for: Xu, Yongchao
    New search for: Lu, Jing
    New search for: Xu, Xipeng

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
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    Document information
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    Document information
    Title:

    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    Contributors:

    Xu, Yongchao (author) / Lu, Jing (author) / Xu, Xipeng (author)

    Published in:

    Applied surface science ; 389 ; 713-720

    Publication date:

    2016-01-01

    Size:

    8 pages

    ISSN:

    0169-4332

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.44

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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