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Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Murarka, S. P. / Steigerwald, J. / Gutmann, R. J.

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Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Murarka, S. P. / Steigerwald, J. / Gutmann, R. J.

Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Murarka, S. P. / Steigerwald, J. / Gutmann, R. J.

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Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Inlaid Copper Multilevel Interconnections Using Planarization by Chemical-Mechanical Polishing

Contributors:

Murarka, S. P. (author) / Steigerwald, J. (author) / Gutmann, R. J. (author)

Published in:

MRS BULLETIN- MATERIALS RESEARCH SOCIETY ; 18 ; 46

Publication date:

1993-01-01

Size:

46 pages

ISSN:

0883-7694

Type of media:

Article (Journal)

Type of material:

Language:

Unknown

Classification:

DDC: 620.11

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