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    Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures

    New search for: Kanjilal, Anwesha
    New search for: Jangid, Vikas
    New search for: Kumar, Praveen

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    Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures

    New search for: Kanjilal, Anwesha
    New search for: Jangid, Vikas
    New search for: Kumar, Praveen

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures

    New search for: Kanjilal, Anwesha
    New search for: Jangid, Vikas
    New search for: Kumar, Praveen

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Critical evaluation of creep behavior of Sn-Ag-Cu solder alloys over wide range of temperatures

    Contributors:

    Kanjilal, Anwesha (author) / Jangid, Vikas (author) / Kumar, Praveen (author)

    Published in:

    MATERIALS SCIENCE AND ENGINEERING A ; 703 ; 144-153

    Publication date:

    2017-01-01

    Size:

    10 pages

    ISSN:

    0921-5093

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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