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    An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates

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    New search for: He, X.
    New search for: Yao, Y.

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    An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates

    New search for: Long, X.
    New search for: He, X.
    New search for: Yao, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates

    New search for: Long, X.
    New search for: He, X.
    New search for: Yao, Y.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    An improved unified creep-plasticity model for SnAgCu solder under a wide range of strain rates

    Contributors:

    Long, X. (author) / He, X. (author) / Yao, Y. (author)

    Published in:

    JOURNAL OF MATERIALS SCIENCE ; 52 ; 6120-6137

    Publication date:

    2017-01-01

    Size:

    18 pages

    ISSN:

    0022-2461

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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