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    Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards

    New search for: Xiao, Kui
    New search for: Yi, Pan
    New search for: Dong, Chaofang
    New search for: Zou, Shiwen
    New search for: Li, Xiaogang

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    Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards

    New search for: Xiao, Kui
    New search for: Yi, Pan
    New search for: Dong, Chaofang
    New search for: Zou, Shiwen
    New search for: Li, Xiaogang

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards

    New search for: Xiao, Kui
    New search for: Yi, Pan
    New search for: Dong, Chaofang
    New search for: Zou, Shiwen
    New search for: Li, Xiaogang

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Page navigation

    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Role of mold in electrochemical migration of copper-clad laminate and electroless nickel/immersion gold printed circuit boards

    Contributors:

    Xiao, Kui (author) / Yi, Pan (author) / Dong, Chaofang (author) / Zou, Shiwen (author) / Li, Xiaogang (author)

    Published in:

    MATERIALS LETTERS ; 210 ; 283-286

    Publication date:

    2018-01-01

    Size:

    4 pages

    ISSN:

    0167-577X

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    Unknown

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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