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    Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates

    New search for: Snugovsky, L.
    New search for: Snugovsky, P.
    New search for: Perovic, D. D.
    New search for: Rutter, J. W.

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    Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates

    New search for: Snugovsky, L.
    New search for: Snugovsky, P.
    New search for: Perovic, D. D.
    New search for: Rutter, J. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates

    New search for: Snugovsky, L.
    New search for: Snugovsky, P.
    New search for: Perovic, D. D.
    New search for: Rutter, J. W.

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

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    Document information
    Title:

    Formation of intermetallic compounds with Sn-Zn-Al solder on copper and electroless nickel-immersion gold substrates

    Contributors:

    Snugovsky, L. (author) / Snugovsky, P. (author) / Perovic, D. D. (author) / Rutter, J. W. (author)

    Published in:

    MATERIALS SCIENCE AND TECHNOLOGY -LONDON- ; 23 ; 1161-1166

    Publication date:

    2007-01-01

    Size:

    6 pages

    ISSN:

    0267-0836

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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