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Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
Mechanical properties and fracture mechanisms of Sn-3.0Ag-0.5Cu solder alloys and joints at cryogenic temperatures
Tian, Ruyu (author) / Tian, Yanhong (author) / Wang, Chenxi (author) / Zhao, Liyou (author)
MATERIALS SCIENCE AND ENGINEERING A ; 684 ; 697-705
2017-01-01
9 pages
Article (Journal)
Unknown
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