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Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Mechanism of improved electromigration reliability using Fe-Ni UBM in wafer level package
Gao, Li-Yin (author) / Zhang, Hao (author) / Li, Cai-Fu (author) / Guo, Jingdong (author) / Liu, Zhi-Quan (author)
Journal of materials science & technology ; 34 ; 1305-1314
2018-01-01
10 pages
Article (Journal)
English
DDC:
620.1105
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