A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps
Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps
Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps
Shen, Yu-An (author) / Ouyang, Fan-Yi (author) / Chen, Chih (author)
MATERIALS LETTERS ; 236 ; 190-193
2019-01-01
4 pages
Article (Journal)
Unknown
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