Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Shen, Yu-An / Ouyang, Fan-Yi / Chen, Chih | British Library Online Contents | 2019

Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2.3Ag-Ni microbumps

Shen, Yu-An / Ouyang, Fan-Yi / Chen, Chih | British Library Online Contents | 2019

Thermomigration of Cu-Sn and Ni-Sn intermetallic compounds during electromigration in Pb-free SnAg solder joints

Chen, H.-Y. / Chen, C. | British Library Online Contents | 2011

Thermomigration in solder joints

Chen, C. / Hsiao, H. Y. / Chang, Y. W. et al. | British Library Online Contents | 2012

Growth orientation of Cu–Sn IMC in Cu/Sn–3.5Ag/Cu–xZn microbumps and Zn-doped solder joints

Chen, W. Y. / Tu, W. / Chang, H. C. et al. | British Library Online Contents | 2014