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    Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality

    New search for: Wang, Quan
    New search for: Hu, Ran
    New search for: Yang, Xiaodan
    New search for: Ding, Jianning

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    Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality

    New search for: Wang, Quan
    New search for: Hu, Ran
    New search for: Yang, Xiaodan
    New search for: Ding, Jianning

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality

    New search for: Wang, Quan
    New search for: Hu, Ran
    New search for: Yang, Xiaodan
    New search for: Ding, Jianning

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

    Access

    Access via TIB
    Check availability in my library
    Order at Subito €

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    Document information
    Similar titles

    Export, share and cite

    Document information
    Title:

    Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality

    Contributors:

    Wang, Quan (author) / Hu, Ran (author) / Yang, Xiaodan (author) / Ding, Jianning (author)

    Published in:

    International journal of material & product technology ; 42 ; 121-129

    Publication date:

    2011-01-01

    Size:

    9 pages

    ISSN:

    0268-1900

    Type of media:

    Article (Journal)

    Type of material:

    Print

    Language:

    English

    Classification:

    DDC:  620.11

    © Metadata Copyright the British Library Board and other contributors. All rights reserved.

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