Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality
Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality
Low-voltage silicon chip/glass ring anodic bonding for MEMS device packaging and experimental evaluation of bonding quality
Wang, Quan (Autor:in) / Hu, Ran (Autor:in) / Yang, Xiaodan (Autor:in) / Ding, Jianning (Autor:in)
International journal of material & product technology ; 42 ; 121-129
01.01.2011
9 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.11
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