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Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Chu, Yin Fun / Yi, Sung / Geng, Phil

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Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Chu, Yin Fun / Yi, Sung / Geng, Phil

Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Chu, Yin Fun / Yi, Sung / Geng, Phil

Access

Access via TIB

Check availability in my library

Order at Subito €

Page navigation

Document information

Similar titles

Export, share and cite

Document information

Title:

Thermal fatigue life prediction of solder joints of plastic ball grid array packages

Contributors:

Chu, Yin Fun (author) / Yi, Sung (author) / Geng, Phil (author)

Published in:

International journal of materials and structural integrity ; 8 ; 3-20

Publication date:

2014-01-01

Size:

18 pages

ISSN:

1745-0055

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.112

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