A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Effect of Lid Materials on the Solder Ball Reliability of Thermally Enhanced Flip-Chip Plastic Ball Grid Array Packages
Jen, Y. M. (author) / Chien, H. H. (author) / Lin, T. S. (author) / Huang, S. H. (author) / Putra, I. S. / Suharto, D.
2006-01-01
6 pages
Article (Journal)
English
DDC:
620.11
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