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Pd-doped Sn Ag Cu In solder material for high drop/shock reliability

Yu, A. M. / Kim, J. K. / Lee, J. H. / Kim, M. S.

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Pd-doped Sn Ag Cu In solder material for high drop/shock reliability

Yu, A. M. / Kim, J. K. / Lee, J. H. / Kim, M. S.

Pd-doped Sn Ag Cu In solder material for high drop/shock reliability

Yu, A. M. / Kim, J. K. / Lee, J. H. / Kim, M. S.

Access

Access via TIB

Check availability in my library

Order at Subito €

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Document information

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Document information

Title:

Pd-doped Sn Ag Cu In solder material for high drop/shock reliability

Contributors:

Yu, A. M. (author) / Kim, J. K. (author) / Lee, J. H. (author) / Kim, M. S. (author)

Published in:

MATERIALS RESEARCH BULLETIN ; 45 ; 359-361

Publication date:

2010-01-01

Size:

3 pages

ISSN:

0025-5408

Type of media:

Article (Journal)

Type of material:

Language:

English

Classification:

DDC: 620.11 / 620

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