Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Eine Plattform für die Wissenschaft: Bauingenieurwesen, Architektur und Urbanistik
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Microstructure and drop/shock reliability of Sn-Ag-Cu-In solder joints
Yu, A-Mi (Autor:in) / Jang, Jae-Won (Autor:in) / Lee, Jong-Hyun (Autor:in) / Kim, Jun-Ki (Autor:in) / Kim, Mok-Soon (Autor:in)
01.01.2014
11 pages
Aufsatz (Zeitschrift)
Englisch
DDC:
620.112
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