A platform for research: civil engineering, architecture and urbanism
The present invention relates to a method for laying tiles (2) on a laying substrate, in which first tile adhesive (8) is applied on the laying substrate and the tiles (2) are subsequently laid in the tile adhesive (8), characterized in that prior to the application of the tile adhesive (8), leveling strips (5) of the same height are fixed on the laying substrate in such a way that the upper faces of the leveling strips (5) lie in a common reference plane, and the tile adhesive (8) is applied between the leveling strips (5) and protrudes above same, and is subsequently removed to the level of the reference plane, generating a smooth tile adhesive layer (11), by using a screeding board (9) guided along the upper faces of the leveling strips (5).
The present invention relates to a method for laying tiles (2) on a laying substrate, in which first tile adhesive (8) is applied on the laying substrate and the tiles (2) are subsequently laid in the tile adhesive (8), characterized in that prior to the application of the tile adhesive (8), leveling strips (5) of the same height are fixed on the laying substrate in such a way that the upper faces of the leveling strips (5) lie in a common reference plane, and the tile adhesive (8) is applied between the leveling strips (5) and protrudes above same, and is subsequently removed to the level of the reference plane, generating a smooth tile adhesive layer (11), by using a screeding board (9) guided along the upper faces of the leveling strips (5).
TILE-LAYING METHOD
PROCEDE DE POSE DE CARREAUX
SCHLUTER WERNER (author)
2016-12-01
Patent
Electronic Resource
English
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
,
Ausbau von Bauwerken, z.B. Treppen, Fußböden