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A platform for research: civil engineering, architecture and urbanism
Secondarily-encapsulated thermal insulation board and preparation method thereof
The invention discloses a secondarily-encapsulated thermal insulation board. The secondarily-encapsulated thermal insulation board comprises a thermal insulation layer, wherein a decoration layer and a base layer are arranged on two opposite sides of the thermal insulation layer respectively, outer edges of both the decoration layer and the base layer are bulged out of the thermal insulation layer to form filling parts which can encircle the thermal insulation layer, and filler is arranged in the filling parts. The invention simultaneously discloses a preparation method for preparing the secondarily-encapsulated thermal insulation board. The method comprises steps as follows: a, the base layer and the decoration layer are arranged on the two opposite sides of the thermal insulation layer respectively, and the outer edges of both the decoration layer and the base layer are bulged out of the thermal insulation layer to form the filling parts which can encircle the thermal insulation layer; b, the filling parts formed in the step a are filled with seal gum; c, after the seal gum is cured, preset clamping slots used for suspending the thermal insulation board are formed in two opposite sides of each filling part. The air permeability of the secondarily-encapsulated thermal insulation board is low, the durability is good, and the preparation method is simple and convenient.
Secondarily-encapsulated thermal insulation board and preparation method thereof
The invention discloses a secondarily-encapsulated thermal insulation board. The secondarily-encapsulated thermal insulation board comprises a thermal insulation layer, wherein a decoration layer and a base layer are arranged on two opposite sides of the thermal insulation layer respectively, outer edges of both the decoration layer and the base layer are bulged out of the thermal insulation layer to form filling parts which can encircle the thermal insulation layer, and filler is arranged in the filling parts. The invention simultaneously discloses a preparation method for preparing the secondarily-encapsulated thermal insulation board. The method comprises steps as follows: a, the base layer and the decoration layer are arranged on the two opposite sides of the thermal insulation layer respectively, and the outer edges of both the decoration layer and the base layer are bulged out of the thermal insulation layer to form the filling parts which can encircle the thermal insulation layer; b, the filling parts formed in the step a are filled with seal gum; c, after the seal gum is cured, preset clamping slots used for suspending the thermal insulation board are formed in two opposite sides of each filling part. The air permeability of the secondarily-encapsulated thermal insulation board is low, the durability is good, and the preparation method is simple and convenient.
Secondarily-encapsulated thermal insulation board and preparation method thereof
AI MINGXING (author) / WU GUANGBIN (author) / LIU YANGZI (author) / CHANG WEIHUA (author) / WANG XUE (author) / GE ZHAOSHEN (author) / LIU PEIYU (author)
2015-09-02
Patent
Electronic Resource
English
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