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Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property
The invention relates to a preparation method of a microwave composite dielectric substrate with high frequency and high dielectric property. The method comprises the steps: mixing ceramic powder with formic acid solutions in a proportion; adding a certain amount of silane coupling agents; adding resins; heating, stirring and drying to obtain ceramic mixed powder; tiling the ceramic mixed powder in a mould for repeatedly oscillating to flatten the ceramic mixed powder; putting the mould in which the powder is filled into a hot press for performing cold press molding at the room temperature under the pressure of 3-12MPa; finally, respectively covering the two sides of the substrate subjected to the cold press molding with copper foils; putting the substrate into the mould again for hot press sintering on a hot press sintering machine; carrying out heat preservation for 2-10 hours at the temperature of 350-390 DEG C under the pressure of 5-22MPa; and then naturally cooling. The microwave composite dielectric substrate with high frequency and high dielectric property has the characteristics of high mechanical property, high dielectric constant, low dielectric loss, high uniformity, high compactness and the like, so that a market requirement on the microwave composite dielectric substrate with high frequency and high dielectric property is met.
Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property
The invention relates to a preparation method of a microwave composite dielectric substrate with high frequency and high dielectric property. The method comprises the steps: mixing ceramic powder with formic acid solutions in a proportion; adding a certain amount of silane coupling agents; adding resins; heating, stirring and drying to obtain ceramic mixed powder; tiling the ceramic mixed powder in a mould for repeatedly oscillating to flatten the ceramic mixed powder; putting the mould in which the powder is filled into a hot press for performing cold press molding at the room temperature under the pressure of 3-12MPa; finally, respectively covering the two sides of the substrate subjected to the cold press molding with copper foils; putting the substrate into the mould again for hot press sintering on a hot press sintering machine; carrying out heat preservation for 2-10 hours at the temperature of 350-390 DEG C under the pressure of 5-22MPa; and then naturally cooling. The microwave composite dielectric substrate with high frequency and high dielectric property has the characteristics of high mechanical property, high dielectric constant, low dielectric loss, high uniformity, high compactness and the like, so that a market requirement on the microwave composite dielectric substrate with high frequency and high dielectric property is met.
Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property
SONG YONGYAO (author) / ZHANG LIXIN (author) / WANG LIJING (author) / ZHAO YUANCHENG (author) / XU YONGKUAN (author)
2015-04-08
Patent
Electronic Resource
English
IPC:
C04B
Kalk
,
LIME
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