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Epoxy resin prime coat compound with high bonding capacity and coating process thereof
The present invention provides an epoxy resin prime coat compound with high bonding capacity and a coating process thereof. The compound comprises a component A containing epoxy resin, a diluent and aflexibilizer and a component B containing a curing agent and a coupling agent, and is characterized by further comprising a component C and a component D, the component C comprises the following components in parts by weight: 20 parts of calcium oxide, 65 parts of water, 10 parts of sawdust with the size fraction of 1-3 mm, and 15 parts of circular super absorbent resin particles, wherein the particle size of the circular super absorbent resin particles in a non-water-absorbing state is 0.1-0.2 mm, and the particle size of the circular super absorbent resin particles in a water-absorbing state is 2-3mm; and the component D is prepared from the following components in parts by weight: 30 parts of iron powder with the size fraction of 0.1 to 0.2 mm, 10 parts of ferroferric oxide with the size fraction of 0.05 to 0.15 mm, and 60 parts of 15-25% dilute nitric acid. According to the invention, the bonding strength between the epoxy floor bottom coating compound and the ground can be effectively improved.
一种高粘结力环氧地坪底涂复合物及涂装工艺,包含环氧树脂以及稀释剂和增韧剂的A组份和包括固化剂、偶联剂的B组份,其特征在于,还包括还包括C和D组份:其中C组份包括,所述C组份按重量份计算:氧化钙20份;水65份;1‑3mm粒级的木屑10份;圆形高吸水性树脂颗粒15份,未吸水状态下粒径0.1‑0.2mm,吸水状态下粒径2‑3mm;所述D组份按重量份计算:0.1‑0.2mm粒级铁粉30份;0.05‑0.15mm粒级的四氧化三铁10份。浓度15‑25%稀硝酸60份。本发明能够有效的提高环氧地坪底涂复合物与地面之间的粘结强度。
Epoxy resin prime coat compound with high bonding capacity and coating process thereof
The present invention provides an epoxy resin prime coat compound with high bonding capacity and a coating process thereof. The compound comprises a component A containing epoxy resin, a diluent and aflexibilizer and a component B containing a curing agent and a coupling agent, and is characterized by further comprising a component C and a component D, the component C comprises the following components in parts by weight: 20 parts of calcium oxide, 65 parts of water, 10 parts of sawdust with the size fraction of 1-3 mm, and 15 parts of circular super absorbent resin particles, wherein the particle size of the circular super absorbent resin particles in a non-water-absorbing state is 0.1-0.2 mm, and the particle size of the circular super absorbent resin particles in a water-absorbing state is 2-3mm; and the component D is prepared from the following components in parts by weight: 30 parts of iron powder with the size fraction of 0.1 to 0.2 mm, 10 parts of ferroferric oxide with the size fraction of 0.05 to 0.15 mm, and 60 parts of 15-25% dilute nitric acid. According to the invention, the bonding strength between the epoxy floor bottom coating compound and the ground can be effectively improved.
一种高粘结力环氧地坪底涂复合物及涂装工艺,包含环氧树脂以及稀释剂和增韧剂的A组份和包括固化剂、偶联剂的B组份,其特征在于,还包括还包括C和D组份:其中C组份包括,所述C组份按重量份计算:氧化钙20份;水65份;1‑3mm粒级的木屑10份;圆形高吸水性树脂颗粒15份,未吸水状态下粒径0.1‑0.2mm,吸水状态下粒径2‑3mm;所述D组份按重量份计算:0.1‑0.2mm粒级铁粉30份;0.05‑0.15mm粒级的四氧化三铁10份。浓度15‑25%稀硝酸60份。本发明能够有效的提高环氧地坪底涂复合物与地面之间的粘结强度。
Epoxy resin prime coat compound with high bonding capacity and coating process thereof
一种高粘结能力的环氧树脂底涂复合物及涂装工艺
HAN BIN (author) / HAN MINGRUI (author)
2020-05-01
Patent
Electronic Resource
Chinese
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