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Ceramic, probe-guiding part, probe card and socket for inspecting package
A ceramic comprises, in terms of mass%, 20.0-55.0% of BN, 5.0-40.0% of SiC and 3.0-60.0% of ZrO2 and/or Si3N4. The ceramic has a heat expansion coefficient at -50 to 500 DEG C of 1.0*10<-6> to 5.0*10<-6>/DEG C, a low chargeability (106 to 1014 omega.cm expressed in volume resistivity) and an excellent free cutting property, so that the ceramic is suitably usable for, e.g., a probe-guiding part guiding a probe of a probe card, a socket for inspecting a package, etc.
以质量％计，由BN：20.0～55.0％、SiC：5.0～40.0％、ZrO和/或SiN：3.0～60.0％构成的陶瓷。该陶瓷在‑50～500℃下的热膨胀系数为1.0×10～5.0×10/℃，低带电性(以体积电阻率计为10～10Ω·cm)和易切削性优异，因此适合使用在例如用于对探针卡的探针进行引导的探针引导构件、封装检查用插座等。
Ceramic, probe-guiding part, probe card and socket for inspecting package
A ceramic comprises, in terms of mass%, 20.0-55.0% of BN, 5.0-40.0% of SiC and 3.0-60.0% of ZrO2 and/or Si3N4. The ceramic has a heat expansion coefficient at -50 to 500 DEG C of 1.0*10<-6> to 5.0*10<-6>/DEG C, a low chargeability (106 to 1014 omega.cm expressed in volume resistivity) and an excellent free cutting property, so that the ceramic is suitably usable for, e.g., a probe-guiding part guiding a probe of a probe card, a socket for inspecting a package, etc.
以质量％计，由BN：20.0～55.0％、SiC：5.0～40.0％、ZrO和/或SiN：3.0～60.0％构成的陶瓷。该陶瓷在‑50～500℃下的热膨胀系数为1.0×10～5.0×10/℃，低带电性(以体积电阻率计为10～10Ω·cm)和易切削性优异，因此适合使用在例如用于对探针卡的探针进行引导的探针引导构件、封装检查用插座等。
Ceramic, probe-guiding part, probe card and socket for inspecting package
陶瓷、探针引导构件、探针卡及封装检查用插座
YAMAGISHI WATARU (author) / MORI KAZUMASA (author) / ETO SHUNICHI (author)
2020-06-05
Patent
Electronic Resource
Chinese
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