A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
Floor heating tile with electric heating chip fired in tile body
The invention relates to the technical field of floor heating equipment, and discloses a floor heating tile with an electric heating chip fired in a tile body. The floor heating tile comprises the tile body and the electric heating chip, wherein a plug connector is electrically connected to the electric heating chip, the tile body is provided with a first groove for embedding the electric heatingchip and a second groove for embedding the plug connector, the plug connector is electrically connected with an external power source, and the surface of the ceramic tile body protrudes or is flush with the surface of the electric heating chip and the surface of the plug connector. Through the above arrangement, the electric heating chip is directly embedded in the ceramic tile body, the heat transfer distance between the electric heating chip and the ceramic tile body is the smallest, and a cement layer is not needed, so that the heat conduction efficiency is high, the temperature rise rate is fast, the energy consumption is low, a complex structure is not needed, and the cost is low; organic compounds such as insulating materials, thermal insulation materials and adhesives are not needed, toxic substances cannot be emitted, and human health cannot be harmed; and paved ceramic tiles have the same pressure bearing capacity, so that breakage, settlement and collapse of the ceramic tilesare avoided, the ground flatness is ensured, and personnel are not prone to stumble and bruise.
本发明涉及地面供暖设备技术领域，公开了一种将电热芯片烧制在瓷砖本体内的地暖瓷砖，包括瓷砖本体和电热芯片，电热芯片电连接有插接件，瓷砖本体设有用于嵌设电热芯片的第一凹槽以及用于嵌设插接件的第二凹槽，插接件与外部电源电连接，且瓷砖本体的表面凸起或平齐于电热芯片和插接件的表面。如此设置，电热芯片直接嵌在瓷砖本体内，与瓷砖本体之间传热距离最小，无需水泥层，故热传导效率高、升温速度快、能耗低，不需要设置复杂的结构，成本低；而且无需绝缘材料、保温材料、胶粘剂等有机化合物质，不会散发有毒物质和危害人体健康；所铺设瓷砖的承压能力相同，不会造成瓷砖断裂、沉降和塌陷，地面平整度得到保证，不易绊倒和摔伤人员。
Floor heating tile with electric heating chip fired in tile body
The invention relates to the technical field of floor heating equipment, and discloses a floor heating tile with an electric heating chip fired in a tile body. The floor heating tile comprises the tile body and the electric heating chip, wherein a plug connector is electrically connected to the electric heating chip, the tile body is provided with a first groove for embedding the electric heatingchip and a second groove for embedding the plug connector, the plug connector is electrically connected with an external power source, and the surface of the ceramic tile body protrudes or is flush with the surface of the electric heating chip and the surface of the plug connector. Through the above arrangement, the electric heating chip is directly embedded in the ceramic tile body, the heat transfer distance between the electric heating chip and the ceramic tile body is the smallest, and a cement layer is not needed, so that the heat conduction efficiency is high, the temperature rise rate is fast, the energy consumption is low, a complex structure is not needed, and the cost is low; organic compounds such as insulating materials, thermal insulation materials and adhesives are not needed, toxic substances cannot be emitted, and human health cannot be harmed; and paved ceramic tiles have the same pressure bearing capacity, so that breakage, settlement and collapse of the ceramic tilesare avoided, the ground flatness is ensured, and personnel are not prone to stumble and bruise.
本发明涉及地面供暖设备技术领域，公开了一种将电热芯片烧制在瓷砖本体内的地暖瓷砖，包括瓷砖本体和电热芯片，电热芯片电连接有插接件，瓷砖本体设有用于嵌设电热芯片的第一凹槽以及用于嵌设插接件的第二凹槽，插接件与外部电源电连接，且瓷砖本体的表面凸起或平齐于电热芯片和插接件的表面。如此设置，电热芯片直接嵌在瓷砖本体内，与瓷砖本体之间传热距离最小，无需水泥层，故热传导效率高、升温速度快、能耗低，不需要设置复杂的结构，成本低；而且无需绝缘材料、保温材料、胶粘剂等有机化合物质，不会散发有毒物质和危害人体健康；所铺设瓷砖的承压能力相同，不会造成瓷砖断裂、沉降和塌陷，地面平整度得到保证，不易绊倒和摔伤人员。
Floor heating tile with electric heating chip fired in tile body
一种将电热芯片烧制在瓷砖本体内的地暖瓷砖
SUN YONGSHUN (author)
2020-08-14
Patent
Electronic Resource
Chinese
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