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Sealing method of ceramic capacitive pressure sensor chip
The invention discloses a sealing method of a ceramic capacitive pressure sensor chip. The method comprises the following steps: 1, polishing, cleaning and drying the surface of a ceramic substrate; 2, performing silk-screen printing of glass slurry on the substrate; 3, drying; 4, performing pressure sintering; 5, brushing the side surface of the glass slurry; and 6, carrying out secondary sintering molding. Fluorine oil and helium sealing performance detection shows that the ceramic capacitive pressure sensor chip is good in sealing performance, the bonding strength of a pressure elastic piece and the ceramic substrate is larger than 40 MPa, and the distance between the ceramic elastic piece and the ceramic substrate can be controlled to be 10-50 [mu]m. The method has the advantages of being simple in process, good in sealing effect, high in bonding strength, good in capacitor spacing controllability and the like.
本发明公开了一种陶瓷电容式压力传感器芯片的封接方法。该方法为：一、陶瓷基底表面打磨、清洗、烘干；二、在基底上丝网印刷玻璃浆料；三、烘干处理；四、加压烧结；五、侧面玻璃浆料涂刷；六、二次烧结成型。本发明制备的陶瓷电容式压力传感器芯片经过氟油和氦气密封性检测，密封性能好，压力弹片与陶瓷基底结合强度大于40MPa，陶瓷弹片与陶瓷基底间距可以控制在10μm～50μm。本发明具有工艺简单、密封效果好、粘接强度高、电容间距可控性好等优点。
Sealing method of ceramic capacitive pressure sensor chip
The invention discloses a sealing method of a ceramic capacitive pressure sensor chip. The method comprises the following steps: 1, polishing, cleaning and drying the surface of a ceramic substrate; 2, performing silk-screen printing of glass slurry on the substrate; 3, drying; 4, performing pressure sintering; 5, brushing the side surface of the glass slurry; and 6, carrying out secondary sintering molding. Fluorine oil and helium sealing performance detection shows that the ceramic capacitive pressure sensor chip is good in sealing performance, the bonding strength of a pressure elastic piece and the ceramic substrate is larger than 40 MPa, and the distance between the ceramic elastic piece and the ceramic substrate can be controlled to be 10-50 [mu]m. The method has the advantages of being simple in process, good in sealing effect, high in bonding strength, good in capacitor spacing controllability and the like.
本发明公开了一种陶瓷电容式压力传感器芯片的封接方法。该方法为：一、陶瓷基底表面打磨、清洗、烘干；二、在基底上丝网印刷玻璃浆料；三、烘干处理；四、加压烧结；五、侧面玻璃浆料涂刷；六、二次烧结成型。本发明制备的陶瓷电容式压力传感器芯片经过氟油和氦气密封性检测，密封性能好，压力弹片与陶瓷基底结合强度大于40MPa，陶瓷弹片与陶瓷基底间距可以控制在10μm～50μm。本发明具有工艺简单、密封效果好、粘接强度高、电容间距可控性好等优点。
Sealing method of ceramic capacitive pressure sensor chip
一种陶瓷电容压力传感器芯片的封接方法
SHAO HAICHENG (author) / QIAO GUANJUN (author) / LIU XINCHENG (author) / HUANG QINGWEI (author) / LIU GUIWU (author) / ZHANG XIANGZHAO (author) / LU HAOJIE (author)
2020-09-15
Patent
Electronic Resource
Chinese
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