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Automatic floor tile laying pasting and gap cleaning method
The invention provides an automatic floor tile laying pasting and gap cleaning method. The automatic floor tile laying pasting and gap cleaning method is characterized by comprising the following steps of the distance measuring working procedure, specifically, a distance measuring device measures the separation distance in front of a vehicle body; floor tile storage and transfer; floor tile cutting, specifically, a moving component inside a cutting device is in transmission connection with the distance measuring device to drive a base of a cutting unit to move, a first air cylinder drives an utility knife to cut floor tiles, and the cut floor tiles are matched with a tile pasting area formed among a distance measuring rod, the edge of the vehicle body and the wall face; floor tile laying pasting; and the tamping working procedure and gap cleaning. The automatic floor tile laying pasting and gap cleaning method automatically runs by utilizing the working procedures of the distance measuring working procedure, the floor tile storage and transfer, the floor tile cutting, the floor tile laying pasting, the tamping working procedure and the gap cleaning, the required floor tile width measuring and cutting are finished, bevel edge cutting is realized, and floor tile tamping prevents hollowing, then mortar and dust cleaning is performed on floor tile gaps, the problem of manual floortile cutting, carrying and laying pasting is solved, and meanwhile, the gap cleaning performs preliminary treatment for subsequent seam beautifying and other work.
本发明提供了一种自动铺贴地砖并清理缝隙的方法,其特征在于,包括以下步骤:测距工序,测距装置对车体前方的间距测量;地砖存放转移;切割地砖,切割装置中的移动组件与测距装置传动连接,带动切割单元的底座运动,第一气缸带动划刀将地砖切割,切割完成的地砖即与测距杆、车体的边缘与墙面之间形成的贴砖区相适配;地砖铺贴;捶打工序以及缝隙清理。利用测距工序、地砖存放转移、切割地砖、地砖铺贴、捶打工序和缝隙清理的工序自动运行,完成所需地砖宽度的测量及切割,实现斜边的切割,并且地砖捶打防止空鼓,然后对地砖缝隙进行清理砂浆和灰尘,解决了人工进行地砖切割并搬运铺贴的问题,同时缝隙清理为后续美缝等工作作预先处理。
Automatic floor tile laying pasting and gap cleaning method
The invention provides an automatic floor tile laying pasting and gap cleaning method. The automatic floor tile laying pasting and gap cleaning method is characterized by comprising the following steps of the distance measuring working procedure, specifically, a distance measuring device measures the separation distance in front of a vehicle body; floor tile storage and transfer; floor tile cutting, specifically, a moving component inside a cutting device is in transmission connection with the distance measuring device to drive a base of a cutting unit to move, a first air cylinder drives an utility knife to cut floor tiles, and the cut floor tiles are matched with a tile pasting area formed among a distance measuring rod, the edge of the vehicle body and the wall face; floor tile laying pasting; and the tamping working procedure and gap cleaning. The automatic floor tile laying pasting and gap cleaning method automatically runs by utilizing the working procedures of the distance measuring working procedure, the floor tile storage and transfer, the floor tile cutting, the floor tile laying pasting, the tamping working procedure and the gap cleaning, the required floor tile width measuring and cutting are finished, bevel edge cutting is realized, and floor tile tamping prevents hollowing, then mortar and dust cleaning is performed on floor tile gaps, the problem of manual floortile cutting, carrying and laying pasting is solved, and meanwhile, the gap cleaning performs preliminary treatment for subsequent seam beautifying and other work.
本发明提供了一种自动铺贴地砖并清理缝隙的方法,其特征在于,包括以下步骤:测距工序,测距装置对车体前方的间距测量;地砖存放转移;切割地砖,切割装置中的移动组件与测距装置传动连接,带动切割单元的底座运动,第一气缸带动划刀将地砖切割,切割完成的地砖即与测距杆、车体的边缘与墙面之间形成的贴砖区相适配;地砖铺贴;捶打工序以及缝隙清理。利用测距工序、地砖存放转移、切割地砖、地砖铺贴、捶打工序和缝隙清理的工序自动运行,完成所需地砖宽度的测量及切割,实现斜边的切割,并且地砖捶打防止空鼓,然后对地砖缝隙进行清理砂浆和灰尘,解决了人工进行地砖切割并搬运铺贴的问题,同时缝隙清理为后续美缝等工作作预先处理。
Automatic floor tile laying pasting and gap cleaning method
一种自动铺贴地砖并清理缝隙的方法
YAN JINLIANG (author)
2020-09-25
Patent
Electronic Resource
Chinese
IPC:
E04F
FINISHING WORK ON BUILDINGS, e.g. STAIRS, FLOORS
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Ausbau von Bauwerken, z.B. Treppen, Fußböden
European Patent Office | 2020
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