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A platform for research: civil engineering, architecture and urbanism
Low-thermal-conductivity mullite light heat-insulating brick
The invention provides a low-thermal-conductivity mullite light heat-insulating brick, and belongs to the technical field of light heat-insulating refractory materials. The low-thermal-conductivity mullite light heat-insulating brick is prepared from the following raw materials by weight: 15-25% of kyanite tailings, 10-30% of medium-low-grade kyanite, 20-30% of kaolin and 20-40% of waste brick blank powder, and 3-4.5% of a pore-forming agent. The volume density of the mullite light heat-insulating brick is less than or equal to 0.6g/cm<3>, the average temperature is 350DEG C, the heat conductivity coefficient is less than or equal to 0.18W/(m.k), and the normal-temperature compressive strength is more than or equal to 2.0MPa.
本发明提供了一种低导热莫来石轻质隔热砖，属于轻质保温耐火材料技术领域。一种低导热莫来石轻质隔热砖，由如下原料制成，以重量百分比计，蓝晶石尾矿15‑25%，中低品位蓝晶石10‑30%，高岭土20‑30%，废砖坯粉20‑40%，总计100%，造孔剂占重量百分比总计的3‑4.5%。本发明莫来石轻质隔热砖的体积密度≤0.6g/cm3，平均温度350℃导热系数≤0.18W/（m·k），常温耐压强度≥2.0MPa。
Low-thermal-conductivity mullite light heat-insulating brick
The invention provides a low-thermal-conductivity mullite light heat-insulating brick, and belongs to the technical field of light heat-insulating refractory materials. The low-thermal-conductivity mullite light heat-insulating brick is prepared from the following raw materials by weight: 15-25% of kyanite tailings, 10-30% of medium-low-grade kyanite, 20-30% of kaolin and 20-40% of waste brick blank powder, and 3-4.5% of a pore-forming agent. The volume density of the mullite light heat-insulating brick is less than or equal to 0.6g/cm<3>, the average temperature is 350DEG C, the heat conductivity coefficient is less than or equal to 0.18W/(m.k), and the normal-temperature compressive strength is more than or equal to 2.0MPa.
本发明提供了一种低导热莫来石轻质隔热砖，属于轻质保温耐火材料技术领域。一种低导热莫来石轻质隔热砖，由如下原料制成，以重量百分比计，蓝晶石尾矿15‑25%，中低品位蓝晶石10‑30%，高岭土20‑30%，废砖坯粉20‑40%，总计100%，造孔剂占重量百分比总计的3‑4.5%。本发明莫来石轻质隔热砖的体积密度≤0.6g/cm3，平均温度350℃导热系数≤0.18W/（m·k），常温耐压强度≥2.0MPa。
Low-thermal-conductivity mullite light heat-insulating brick
一种低导热莫来石轻质隔热砖
YANG WENWEI (author)
2020-12-25
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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