A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
The invention provides a preparation method of a chip component. The preparation method comprises the following steps: adding 50-55 parts by weight of ceramic powder, 26-35 parts by weight of polyacrylic resin, 0.7-0.9 part by weight of a plasticizer, 5-8 parts by weight of propyl acetate, 5-8 parts by weight of isobutanol and 6-10 parts by weight of a dispersing agent into a stirrer, and stirringand mixing to obtain mixed slurry; injecting the mixed slurry into a steel belt casting machine to prepare a substrate blank; slitting the base plate blank into cuboids with the same size through a high-precision and high-speed cutting machine, and forming a base plate piece; sintering at high temperature to obtain a ceramic raw plate; grinding to obtain a ceramic finished product plate; printinga circuit pattern to obtain a COB ceramic substrate; and sequentially covering a uniform nickel layer and a uniform tin layer on the COB ceramic substrate to obtain a chip component substrate. Compared with the prior art, the preparation method has the following beneficial effects that the manufacturing process of the chip component substrate is simplified, and the yield of the chip component substrate is improved.
本发明提供一种片式元器件的制备方法，包括如下步骤：将50～55重量份陶瓷粉、26～35重量份聚丙烯酸树脂、0.7～0.9重量份增塑剂、5～8重量份醋酸丙酯、5～8重量份异丁醇、6～10重量份分散剂添加至搅拌机中进行搅拌混合制得混合浆料；混合浆料注入钢带流延机内，制得基板坯料；基板坯料通过高精度和高速的切割机分切成大小一致的长方体，形成基板片；高温烧结制得陶瓷原板；研磨制得陶瓷成品板；印制线路图案以得到COB陶瓷基板；在COB陶瓷基板上先后覆盖一层均匀的镍层和锡层，以得到片式元器件基板，与现有技术相比，本发明具有如下的有益效果：简化了片式元器件基板制作的工序，提高片式元器件基板的良品率。
The invention provides a preparation method of a chip component. The preparation method comprises the following steps: adding 50-55 parts by weight of ceramic powder, 26-35 parts by weight of polyacrylic resin, 0.7-0.9 part by weight of a plasticizer, 5-8 parts by weight of propyl acetate, 5-8 parts by weight of isobutanol and 6-10 parts by weight of a dispersing agent into a stirrer, and stirringand mixing to obtain mixed slurry; injecting the mixed slurry into a steel belt casting machine to prepare a substrate blank; slitting the base plate blank into cuboids with the same size through a high-precision and high-speed cutting machine, and forming a base plate piece; sintering at high temperature to obtain a ceramic raw plate; grinding to obtain a ceramic finished product plate; printinga circuit pattern to obtain a COB ceramic substrate; and sequentially covering a uniform nickel layer and a uniform tin layer on the COB ceramic substrate to obtain a chip component substrate. Compared with the prior art, the preparation method has the following beneficial effects that the manufacturing process of the chip component substrate is simplified, and the yield of the chip component substrate is improved.
本发明提供一种片式元器件的制备方法，包括如下步骤：将50～55重量份陶瓷粉、26～35重量份聚丙烯酸树脂、0.7～0.9重量份增塑剂、5～8重量份醋酸丙酯、5～8重量份异丁醇、6～10重量份分散剂添加至搅拌机中进行搅拌混合制得混合浆料；混合浆料注入钢带流延机内，制得基板坯料；基板坯料通过高精度和高速的切割机分切成大小一致的长方体，形成基板片；高温烧结制得陶瓷原板；研磨制得陶瓷成品板；印制线路图案以得到COB陶瓷基板；在COB陶瓷基板上先后覆盖一层均匀的镍层和锡层，以得到片式元器件基板，与现有技术相比，本发明具有如下的有益效果：简化了片式元器件基板制作的工序，提高片式元器件基板的良品率。
Preparation method of chip component
一种片式元器件的制备方法
WEI WEI (author)
2021-01-26
Patent
Electronic Resource
Chinese