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Preparation method of chip module
The invention relates to the technical field of chip module preparation, and particularly discloses a preparation method of a chip module, which comprises the following steps: firstly, mixing Mn304 of a component A, Co2O3 of a component B, Ni0 of a component C and Fe2O3 of a component D, ball-milling, roasting and dehydrating to obtain a dry ball-milled raw material, secondly, uniformly mixing the ball-milled raw material with an adhesive to obtain chip slurry, then pressing the chip slurry into a sheet, and finally preparing the chip module. The preparation method comprises the following steps: preparing a thin sheet, roasting the thin sheet, polishing two surfaces of the roasted thin sheet to obtain a blank sheet, and finally sintering the blank sheet at the temperature of 1280-1300 DEG C to obtain the chip module. Through the synergistic compounding effect of all the components, the thickness of the manufactured chip module is increased, double-sided polishing can be conveniently carried out on the chip module, the smoothness and consistency of the surface of the chip module are ensured, resistance drift caused by performance change of a resistor in the long-term working process is prevented, the chip module is not prone to breakdown when current repeatedly passes through the chip module, and the service life of the chip module is prolonged.
本发明涉及芯片模组制备技术领域，具体公开了一种芯片模组的制备方法，首先，将A组份的Mn304、B组份的Co2O3、C组份的Ni0、D组份的Fe2O3混合、球磨，焙烧脱水，得到干燥的球磨原料，其次，将球磨原料与粘合剂混合均匀，得到芯片浆料，然后将芯片浆料压制成薄片，焙烧薄片，然后对焙烧处理后的薄片进行两面打磨，得到坯片，最终在1280℃‑1300℃的温度下对坯片进行烧结，得到芯片模组。通过各组分的协同复配作用，所制成的芯片模组厚度增加，便于对其进行双面打磨，确保其表面的光滑性和一致性，防止电阻在长期工作过程中发生性能变化而导致阻值漂移，并且使其在反复通过电流时不易被击穿，延长使用寿命。
Preparation method of chip module
The invention relates to the technical field of chip module preparation, and particularly discloses a preparation method of a chip module, which comprises the following steps: firstly, mixing Mn304 of a component A, Co2O3 of a component B, Ni0 of a component C and Fe2O3 of a component D, ball-milling, roasting and dehydrating to obtain a dry ball-milled raw material, secondly, uniformly mixing the ball-milled raw material with an adhesive to obtain chip slurry, then pressing the chip slurry into a sheet, and finally preparing the chip module. The preparation method comprises the following steps: preparing a thin sheet, roasting the thin sheet, polishing two surfaces of the roasted thin sheet to obtain a blank sheet, and finally sintering the blank sheet at the temperature of 1280-1300 DEG C to obtain the chip module. Through the synergistic compounding effect of all the components, the thickness of the manufactured chip module is increased, double-sided polishing can be conveniently carried out on the chip module, the smoothness and consistency of the surface of the chip module are ensured, resistance drift caused by performance change of a resistor in the long-term working process is prevented, the chip module is not prone to breakdown when current repeatedly passes through the chip module, and the service life of the chip module is prolonged.
本发明涉及芯片模组制备技术领域，具体公开了一种芯片模组的制备方法，首先，将A组份的Mn304、B组份的Co2O3、C组份的Ni0、D组份的Fe2O3混合、球磨，焙烧脱水，得到干燥的球磨原料，其次，将球磨原料与粘合剂混合均匀，得到芯片浆料，然后将芯片浆料压制成薄片，焙烧薄片，然后对焙烧处理后的薄片进行两面打磨，得到坯片，最终在1280℃‑1300℃的温度下对坯片进行烧结，得到芯片模组。通过各组分的协同复配作用，所制成的芯片模组厚度增加，便于对其进行双面打磨，确保其表面的光滑性和一致性，防止电阻在长期工作过程中发生性能变化而导致阻值漂移，并且使其在反复通过电流时不易被击穿，延长使用寿命。
Preparation method of chip module
一种芯片模组的制备方法
YAO LIJUN (author) / HUANG YINCHI (author) / YAO PEIPEI (author) / CAI YANGGANG (author) / HUANG WENJIE (author) / CHEN XIONGWEI (author) / WU DAN (author)
2025-01-07
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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