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A platform for research: civil engineering, architecture and urbanism
Ceramic substrate for integrated packaging
The invention discloses a ceramic substrate for integrated packaging. In the invention, aluminum nitride, boron nitride, aluminum oxide and beryllium oxide are used as main raw materials, and meanwhile, additives such as a glass sintering aid, copper-aluminum alloy nanoparticles, rare earth oxide, a solvent, a plasticizer, a dispersing agent and a binder are added, so that the physical and chemical properties of the ceramic substrate are further optimized; accoridng to GB/T 36133-2018, the thermal conductivity of the ceramic substrate for integrated packaging is 470 to 495 W/(m.k); the cuttingequipment can cut the ceramic substrate into six pieces through matched rotation of the upper supporting plate and the lower supporting plate, and meanwhile, cutting of the ceramic substrates of different sizes can be completed; the cutting is efficient, the cutting equipment can cut two ceramic substrates at the same time, and the cutting efficiency is high. In addition, the whole feeding and discharging process is automatic, and participation of operators is not needed.
本发明公开一种用于集成封装的陶瓷基板，本发明以氮化铝、氮化硼、氧化铝和氧化铍作为主要原料，同时添加了玻璃烧结助剂、铜铝合金纳米颗粒、稀土氧化物、溶剂、增塑剂、分散剂和粘结剂等添加剂，进一步优化了陶瓷基板的物化性能，根据GB/T 36133‑2018，该用于集成封装的陶瓷基板的导热率为470W/(m·k)‑495W/(m·k)，切割设备通过上支撑板与下支撑板的配合旋转，可以将陶瓷基板切割呈六片，同时可以完成不同大小的陶瓷基板切割，切割高效，切割设备可以同时对两个陶瓷基板进行切割切割效率高，同时整个上料以及下料过程自动化，无需操作人员参与。
Ceramic substrate for integrated packaging
The invention discloses a ceramic substrate for integrated packaging. In the invention, aluminum nitride, boron nitride, aluminum oxide and beryllium oxide are used as main raw materials, and meanwhile, additives such as a glass sintering aid, copper-aluminum alloy nanoparticles, rare earth oxide, a solvent, a plasticizer, a dispersing agent and a binder are added, so that the physical and chemical properties of the ceramic substrate are further optimized; accoridng to GB/T 36133-2018, the thermal conductivity of the ceramic substrate for integrated packaging is 470 to 495 W/(m.k); the cuttingequipment can cut the ceramic substrate into six pieces through matched rotation of the upper supporting plate and the lower supporting plate, and meanwhile, cutting of the ceramic substrates of different sizes can be completed; the cutting is efficient, the cutting equipment can cut two ceramic substrates at the same time, and the cutting efficiency is high. In addition, the whole feeding and discharging process is automatic, and participation of operators is not needed.
本发明公开一种用于集成封装的陶瓷基板，本发明以氮化铝、氮化硼、氧化铝和氧化铍作为主要原料，同时添加了玻璃烧结助剂、铜铝合金纳米颗粒、稀土氧化物、溶剂、增塑剂、分散剂和粘结剂等添加剂，进一步优化了陶瓷基板的物化性能，根据GB/T 36133‑2018，该用于集成封装的陶瓷基板的导热率为470W/(m·k)‑495W/(m·k)，切割设备通过上支撑板与下支撑板的配合旋转，可以将陶瓷基板切割呈六片，同时可以完成不同大小的陶瓷基板切割，切割高效，切割设备可以同时对两个陶瓷基板进行切割切割效率高，同时整个上料以及下料过程自动化，无需操作人员参与。
Ceramic substrate for integrated packaging
一种用于集成封装的陶瓷基板
CHEN GUIFENG (author)
2021-02-05
Patent
Electronic Resource
Chinese
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