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Preparation method and device of ceramic substrate for packaging PIM module
The invention relates to the technical field of electronic packaging materials, in particular to a preparation method of a ceramic substrate for packaging a PIM module, and the method comprises the following steps: adding Al2O3 powder, a sintering aid, a surfactant and an organic solvent of various dimensions into a ball mill according to a preset proportion for ball milling and drying; adding a thickening agent into the ball mill, carrying out secondary ball milling, outputting a mixture from the ball mill after secondary ball milling, and carrying out vacuum defoaming to obtain tape casting slurry with the viscosity of 20000-24000mPa. S; and carrying out tape casting on the tape casting slurry on a tape casting machine to obtain a tape casting green body sheet, sintering the tape casting green body sheet in a kiln at 850-1350 DEG C, and carrying out high-temperature heat preservation for 5-7 hours to obtain the ceramic substrate with the preset specification. According to the method, the heat-conducting property of the Al2O3 ceramic substrate is improved through Al2O3 with different particle sizes, the manufacturing cost of the ceramic substrate for packaging the PIM module is reduced, and the purposes of reducing cost and improving efficiency are achieved.
本发明涉及电子封装材料技术领域，尤其涉及一种PIM模块封装用陶瓷衬底的制备方法，该方法包括：将多种尺寸规格的Al2O3粉、烧结助剂、表面活性剂和有机溶剂按预设比例加入球磨机进行球磨并干燥；再在球磨机中加入增稠剂后进行二次球磨，并在二次球磨后，从球磨机里输出混合料，通过真空脱泡获得粘度为20000～24000mPa·s的流延浆料；流延浆料在流延机上流延成型，得到流延生坯片，并将流延生坯片在850～1350℃的窑炉中烧结，高温保温5‑7小时，烧结成预设规格的陶瓷基板。该方法通过不同粒径的Al2O3来提高Al2O3陶瓷基板的导热性能，降低PIM模块封装用陶瓷衬底的制造成本，实现降本增效目的。
Preparation method and device of ceramic substrate for packaging PIM module
The invention relates to the technical field of electronic packaging materials, in particular to a preparation method of a ceramic substrate for packaging a PIM module, and the method comprises the following steps: adding Al2O3 powder, a sintering aid, a surfactant and an organic solvent of various dimensions into a ball mill according to a preset proportion for ball milling and drying; adding a thickening agent into the ball mill, carrying out secondary ball milling, outputting a mixture from the ball mill after secondary ball milling, and carrying out vacuum defoaming to obtain tape casting slurry with the viscosity of 20000-24000mPa. S; and carrying out tape casting on the tape casting slurry on a tape casting machine to obtain a tape casting green body sheet, sintering the tape casting green body sheet in a kiln at 850-1350 DEG C, and carrying out high-temperature heat preservation for 5-7 hours to obtain the ceramic substrate with the preset specification. According to the method, the heat-conducting property of the Al2O3 ceramic substrate is improved through Al2O3 with different particle sizes, the manufacturing cost of the ceramic substrate for packaging the PIM module is reduced, and the purposes of reducing cost and improving efficiency are achieved.
本发明涉及电子封装材料技术领域，尤其涉及一种PIM模块封装用陶瓷衬底的制备方法，该方法包括：将多种尺寸规格的Al2O3粉、烧结助剂、表面活性剂和有机溶剂按预设比例加入球磨机进行球磨并干燥；再在球磨机中加入增稠剂后进行二次球磨，并在二次球磨后，从球磨机里输出混合料，通过真空脱泡获得粘度为20000～24000mPa·s的流延浆料；流延浆料在流延机上流延成型，得到流延生坯片，并将流延生坯片在850～1350℃的窑炉中烧结，高温保温5‑7小时，烧结成预设规格的陶瓷基板。该方法通过不同粒径的Al2O3来提高Al2O3陶瓷基板的导热性能，降低PIM模块封装用陶瓷衬底的制造成本，实现降本增效目的。
Preparation method and device of ceramic substrate for packaging PIM module
一种PIM模块封装用陶瓷衬底的制备方法及装置
DUAN JINCHI (author) / LIAO GUANGCHAO (author)
2023-11-07
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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