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A platform for research: civil engineering, architecture and urbanism
Low-temperature ceramic sintering powder process for chip packaging and bonding
The invention discloses a low-temperature ceramic sintering powder process for chip packaging and bonding, which comprises the following steps: S1, mixing solid materials required by ceramic, adding water, and pulverizing and grinding the materials; S2, standing the ground materials, naturally drying the materials into powder cake, and grinding the powder cake into powder by a grinder to obtain ceramic powder; s3, mixing the ceramic powder obtained in the S2 with an adhesive, and mixing the components to obtain a standby material; S4, carrying out powder cold press molding on the standby material to obtain a blank; S5, putting a molded sample into a multi-stage baking device, and carrying out hot press sintering at the temperatures of 200-600 DEG C, 600-1000 DEG C and 1000-1600 DEG C in sequence; S6, cooling the sintered product in a natural air cooling manner, and packaging the final product. According to the method, the formed sample is put into the multi-stage baking device for hot-pressing sintering, and with the gradual increase of the temperature, clear layering can be ensured after the texture of a blank is changed during baking, a better blank forming effect is ensured, andtherefore, the quality of ceramic powder is ensured.
本发明公开了一种用于芯片封装键合低温陶瓷烧结粉体工艺，包括如下步骤，步骤S1：将陶瓷所需的固体材料混合，加水后进行粉碎研磨，步骤S2：将研磨后的材料静置，自然干燥成粉饼，然后通过研磨机研磨成粉，得到陶瓷粉剂，步骤S3：将S2中获得的陶瓷粉剂混入粘合剂，混合成备用料，步骤S4：将备用料通过粉体冷压成型制成胚体，步骤S5：然后将成型样品放入多等级烘烤装置进行热压烧结，炉内温度依次200‑600℃，600‑1000℃和1000‑1600℃，步骤S6：在烧制成型后，通过自然风冷方式冷却，封装完成，通过将成型样品放入多等级烘烤装置进行热压烧结，随着温度的逐级升高，能够保证坯料烘烤时质地发生变化后，层次分明，保证坯料成型效果更好，保证陶瓷粉体质量。
Low-temperature ceramic sintering powder process for chip packaging and bonding
The invention discloses a low-temperature ceramic sintering powder process for chip packaging and bonding, which comprises the following steps: S1, mixing solid materials required by ceramic, adding water, and pulverizing and grinding the materials; S2, standing the ground materials, naturally drying the materials into powder cake, and grinding the powder cake into powder by a grinder to obtain ceramic powder; s3, mixing the ceramic powder obtained in the S2 with an adhesive, and mixing the components to obtain a standby material; S4, carrying out powder cold press molding on the standby material to obtain a blank; S5, putting a molded sample into a multi-stage baking device, and carrying out hot press sintering at the temperatures of 200-600 DEG C, 600-1000 DEG C and 1000-1600 DEG C in sequence; S6, cooling the sintered product in a natural air cooling manner, and packaging the final product. According to the method, the formed sample is put into the multi-stage baking device for hot-pressing sintering, and with the gradual increase of the temperature, clear layering can be ensured after the texture of a blank is changed during baking, a better blank forming effect is ensured, andtherefore, the quality of ceramic powder is ensured.
本发明公开了一种用于芯片封装键合低温陶瓷烧结粉体工艺，包括如下步骤，步骤S1：将陶瓷所需的固体材料混合，加水后进行粉碎研磨，步骤S2：将研磨后的材料静置，自然干燥成粉饼，然后通过研磨机研磨成粉，得到陶瓷粉剂，步骤S3：将S2中获得的陶瓷粉剂混入粘合剂，混合成备用料，步骤S4：将备用料通过粉体冷压成型制成胚体，步骤S5：然后将成型样品放入多等级烘烤装置进行热压烧结，炉内温度依次200‑600℃，600‑1000℃和1000‑1600℃，步骤S6：在烧制成型后，通过自然风冷方式冷却，封装完成，通过将成型样品放入多等级烘烤装置进行热压烧结，随着温度的逐级升高，能够保证坯料烘烤时质地发生变化后，层次分明，保证坯料成型效果更好，保证陶瓷粉体质量。
Low-temperature ceramic sintering powder process for chip packaging and bonding
一种用于芯片封装键合低温陶瓷烧结粉体工艺
GAO YANLING (author) / DONG JINYONG (author)
2021-03-30
Patent
Electronic Resource
Chinese
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