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Pore-filling tungsten slurry for metalizing white aluminum oxide ceramic substrate, and preparation method thereof
The invention relates to the technical field of ceramic slurry, and provides a pore-filling tungsten slurry for metalizing a white aluminum oxide ceramic substrate. The slurry comprises, by weight, 3-15% of organic carrier, 82-95% of tungsten powder and 0.5-10% of multiphase ceramic powder. The invention also provides a preparation method of the pore-filling tungsten slurry for metalizing the white aluminum oxide ceramic substrate. The problems that layering is prone to occurring, the volume density is not high, the viscosity is not stable, hole filling is not full, and the sintering matching performance with an aluminum oxide ceramic diaphragm is poor are solved, and the prepared product often has the advantages that the electrical performance reaches the standard, and the reliability is high.
本发明涉及陶瓷浆料技术领域，提供了白色氧化铝陶瓷基板金属化的填孔钨浆料，包括以下重量百分比的原料：有机载体3～15％、钨粉82～95％和复相陶瓷粉0.5～10％；本发明还提供了该白色氧化铝陶瓷基板金属化的填孔钨浆料的制备方法。本发明减少容易发生分层、体积密度不高、粘度不稳定、填孔不饱满、与氧化铝陶瓷膜片的烧结匹配性差等问题，使制备的产品常存在电性能达标、可靠性高。
Pore-filling tungsten slurry for metalizing white aluminum oxide ceramic substrate, and preparation method thereof
The invention relates to the technical field of ceramic slurry, and provides a pore-filling tungsten slurry for metalizing a white aluminum oxide ceramic substrate. The slurry comprises, by weight, 3-15% of organic carrier, 82-95% of tungsten powder and 0.5-10% of multiphase ceramic powder. The invention also provides a preparation method of the pore-filling tungsten slurry for metalizing the white aluminum oxide ceramic substrate. The problems that layering is prone to occurring, the volume density is not high, the viscosity is not stable, hole filling is not full, and the sintering matching performance with an aluminum oxide ceramic diaphragm is poor are solved, and the prepared product often has the advantages that the electrical performance reaches the standard, and the reliability is high.
本发明涉及陶瓷浆料技术领域，提供了白色氧化铝陶瓷基板金属化的填孔钨浆料，包括以下重量百分比的原料：有机载体3～15％、钨粉82～95％和复相陶瓷粉0.5～10％；本发明还提供了该白色氧化铝陶瓷基板金属化的填孔钨浆料的制备方法。本发明减少容易发生分层、体积密度不高、粘度不稳定、填孔不饱满、与氧化铝陶瓷膜片的烧结匹配性差等问题，使制备的产品常存在电性能达标、可靠性高。
Pore-filling tungsten slurry for metalizing white aluminum oxide ceramic substrate, and preparation method thereof
白色氧化铝陶瓷基板金属化的填孔钨浆料及其制备方法
XIE BO (author) / JIANG YUEQING (author) / FENG QINGFU (author) / DENG RUI (author) / LI JUN (author)
2021-06-08
Patent
Electronic Resource
Chinese
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