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Glass powder and preparation method thereof, and method for coating NTC thermistor with glass powder
The invention provides glass powder, a preparation method of the glass powder and a method for coating a NTC thermistor with the glass powder. The glass powder is prepared from the following raw materials in percentage by mass: 50-60% of SiO2, 7-10% of ZrO2, 7-12% of ZnO, 6-8% of BaO, 6-8% of CaO, 6-9% of Al2O3, 1.5-4% of K2O, 1-2% of Na2O and 0.5-3% of MgO. The preparation cost of the glass powder is low, environment-friendly requirements are met, the softening point of the glass powder is 690-720 DEG C, a thermal expansion coefficient is 8.5-9.7 ppm/DEG C, dense sintering can be achieved at a temperature of 860-900 DEG C, the sintered color of a coated glass layer is transparent, and the glass powder can be used for surface coating of a chip NTC thermistor and meets requirements on device appearance, size, electroplating liquid corrosion resistance and electrical stability.
本发明提供了一种玻璃粉及其制备方法、NTC热敏电阻涂覆玻璃粉的方法,所述玻璃粉由如下质量百分含量的原料制成:50~60%SiO2、7~10%ZrO2、7~12%ZnO、6~8%BaO、6~8%CaO、6~9%Al2O3、1.5~4%K2O、1~2%Na2O和0.5~3%MgO。本发明的玻璃粉的制备成本低,满足环保要求,其软化点为690~720℃,热膨胀系数为8.5~9.7ppm/℃,并在860~900℃可实现致密烧结,涂覆后的玻璃层烧结颜色为透明状,可用于片式NTC热敏电阻的表面包覆,满足器件外观、尺寸、耐电镀液腐蚀、电性稳定性要求。
Glass powder and preparation method thereof, and method for coating NTC thermistor with glass powder
The invention provides glass powder, a preparation method of the glass powder and a method for coating a NTC thermistor with the glass powder. The glass powder is prepared from the following raw materials in percentage by mass: 50-60% of SiO2, 7-10% of ZrO2, 7-12% of ZnO, 6-8% of BaO, 6-8% of CaO, 6-9% of Al2O3, 1.5-4% of K2O, 1-2% of Na2O and 0.5-3% of MgO. The preparation cost of the glass powder is low, environment-friendly requirements are met, the softening point of the glass powder is 690-720 DEG C, a thermal expansion coefficient is 8.5-9.7 ppm/DEG C, dense sintering can be achieved at a temperature of 860-900 DEG C, the sintered color of a coated glass layer is transparent, and the glass powder can be used for surface coating of a chip NTC thermistor and meets requirements on device appearance, size, electroplating liquid corrosion resistance and electrical stability.
本发明提供了一种玻璃粉及其制备方法、NTC热敏电阻涂覆玻璃粉的方法,所述玻璃粉由如下质量百分含量的原料制成:50~60%SiO2、7~10%ZrO2、7~12%ZnO、6~8%BaO、6~8%CaO、6~9%Al2O3、1.5~4%K2O、1~2%Na2O和0.5~3%MgO。本发明的玻璃粉的制备成本低,满足环保要求,其软化点为690~720℃,热膨胀系数为8.5~9.7ppm/℃,并在860~900℃可实现致密烧结,涂覆后的玻璃层烧结颜色为透明状,可用于片式NTC热敏电阻的表面包覆,满足器件外观、尺寸、耐电镀液腐蚀、电性稳定性要求。
Glass powder and preparation method thereof, and method for coating NTC thermistor with glass powder
一种玻璃粉及其制备方法、NTC热敏电阻涂覆玻璃粉的方法
LIU JIAN (author) / NIE MIN (author) / WANG YINGXIN (author) / PENG HU (author) / SONG YEHUI (author)
2021-06-15
Patent
Electronic Resource
Chinese
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