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Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate
The invention discloses a preparation method of a high-dielectric low-loss high-frequency microwave composite dielectric substrate, and belongs to the field of microwave electronic component ceramic materials, wherein the preparation method comprises the following steps: preparing CaTiO3 and Li0.5Sm0.5TiO3 according to a molar ratio to form CLST ceramic powder; ball-milling the ceramic powder; sintering at high temperature; carrying out surface treatment on the ceramic powder by using a silane coupling agent; proportioning the ceramic powder subjected to surface treatment and polytetrafluoroethylene emulsion; adding a demulsifier for demulsification; standing and filtering to form composite dough; carrying out calendering molding or compression molding; and carrying out hot pressed sintering on a molded green body coated with copper foils on two surfaces to form the high-dielectric low-loss high-frequency microwave composite dielectric substrate. The problems that an existing microwave dielectric ceramic material is low in dielectric constant, large in loss, large in temperature coefficient of resonance frequency and free of continuous batch production capacity are solved. The substrate is widely applied to the modern microwave electronic communication fields of spaceflight electronic equipment circuit boards, satellite communication, Beidou systems and the like.
一种高介电低损耗高频微波复合介质基板的制备方法,属于微波电子元器件陶瓷材料领域,包括如下步骤:按照摩尔比对CaTiO3、Li0.5Sm0.5TiO3进行配料形成CLST瓷粉;瓷粉球磨;高温烧结;使用硅烷偶联剂对瓷粉进行表面处理;将经过表面处理的瓷粉与聚四氟乙烯乳液进行配料;加入破乳剂进行破乳;经静置和过滤形成复合面团;过压延成型或者模压成型;将成型生坯双面覆铜箔进行热压烧结,形成高介电低损耗高频微波复合介质基板。解决了现有微波介质陶瓷材料介电常数低、损耗大、谐振频率温度系数较大、不具备连续批产能力的问题。广泛应用于航天电子装备电路板、卫星通讯、北斗系统等现代微波电子通讯领域。
Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate
The invention discloses a preparation method of a high-dielectric low-loss high-frequency microwave composite dielectric substrate, and belongs to the field of microwave electronic component ceramic materials, wherein the preparation method comprises the following steps: preparing CaTiO3 and Li0.5Sm0.5TiO3 according to a molar ratio to form CLST ceramic powder; ball-milling the ceramic powder; sintering at high temperature; carrying out surface treatment on the ceramic powder by using a silane coupling agent; proportioning the ceramic powder subjected to surface treatment and polytetrafluoroethylene emulsion; adding a demulsifier for demulsification; standing and filtering to form composite dough; carrying out calendering molding or compression molding; and carrying out hot pressed sintering on a molded green body coated with copper foils on two surfaces to form the high-dielectric low-loss high-frequency microwave composite dielectric substrate. The problems that an existing microwave dielectric ceramic material is low in dielectric constant, large in loss, large in temperature coefficient of resonance frequency and free of continuous batch production capacity are solved. The substrate is widely applied to the modern microwave electronic communication fields of spaceflight electronic equipment circuit boards, satellite communication, Beidou systems and the like.
一种高介电低损耗高频微波复合介质基板的制备方法,属于微波电子元器件陶瓷材料领域,包括如下步骤:按照摩尔比对CaTiO3、Li0.5Sm0.5TiO3进行配料形成CLST瓷粉;瓷粉球磨;高温烧结;使用硅烷偶联剂对瓷粉进行表面处理;将经过表面处理的瓷粉与聚四氟乙烯乳液进行配料;加入破乳剂进行破乳;经静置和过滤形成复合面团;过压延成型或者模压成型;将成型生坯双面覆铜箔进行热压烧结,形成高介电低损耗高频微波复合介质基板。解决了现有微波介质陶瓷材料介电常数低、损耗大、谐振频率温度系数较大、不具备连续批产能力的问题。广泛应用于航天电子装备电路板、卫星通讯、北斗系统等现代微波电子通讯领域。
Production method of high-dielectric low-loss high-frequency microwave composite dielectric substrate
一种高介电低损耗高频微波复合介质基板生产方法
YANG JUN (author) / BAN XIUFENG (author) / PANG JINBIAO (author) / HAN YUCHENG (author) / ZHANG XIU (author) / YAO CHAOZONG (author) / YING JIAN (author)
2021-07-20
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
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