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Ceramic-based printed circuit board and preparation process thereof
The invention relates to a ceramic-based printed circuit board which comprises a ceramic substrate, a copper-clad layer and a covering layer which are sequentially attached from bottom to top. The ceramic substrate comprises the following components in parts by weight: 65-85 parts of aluminum oxide, 20-30 parts of silicon oxide, 20-40 parts of silicon carbide and 1-5 parts of manganese oxide. The invention further discloses a preparation process. The process has the beneficial effects that the hardness can be effectively reduced, good heat transfer can be ensured, and the processing cost is reduced.
本发明涉及一种陶瓷基印制电路板,包括从下至上依次贴合的陶瓷基板、覆铜层、覆合层;所述的陶瓷基板包括如下重量比的各组分:氧化铝:65~85份,氧化硅20~30份,碳化硅20~40份,氧化锰1~5份。还公开了其制备工艺。本发明达到的有益效果是:既能有效降低硬度又能保证良好热传递、降低加工成本。
Ceramic-based printed circuit board and preparation process thereof
The invention relates to a ceramic-based printed circuit board which comprises a ceramic substrate, a copper-clad layer and a covering layer which are sequentially attached from bottom to top. The ceramic substrate comprises the following components in parts by weight: 65-85 parts of aluminum oxide, 20-30 parts of silicon oxide, 20-40 parts of silicon carbide and 1-5 parts of manganese oxide. The invention further discloses a preparation process. The process has the beneficial effects that the hardness can be effectively reduced, good heat transfer can be ensured, and the processing cost is reduced.
本发明涉及一种陶瓷基印制电路板,包括从下至上依次贴合的陶瓷基板、覆铜层、覆合层;所述的陶瓷基板包括如下重量比的各组分:氧化铝:65~85份,氧化硅20~30份,碳化硅20~40份,氧化锰1~5份。还公开了其制备工艺。本发明达到的有益效果是:既能有效降低硬度又能保证良好热传递、降低加工成本。
Ceramic-based printed circuit board and preparation process thereof
一种陶瓷基印制电路板及其制备工艺
CHEN SHAOZHI (author) / CHEN YUE (author) / ZHENG HAIJUN (author) / XIONG LINGPENG (author) / WANG QUANCAI (author) / ZHANG YONG (author)
2021-07-30
Patent
Electronic Resource
Chinese
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