A platform for research: civil engineering, architecture and urbanism
A platform for research: civil engineering, architecture and urbanism
PROCESS FOR PRODUCING A CERAMIC CIRCUIT BOARD
According to one embodiment, a ceramic circuit board includes a ceramic substrate (1), a copper circuit plate (5) and a brazing material protrudent part (4a). The copper circuit plate (5) is bonded to at least one surface of the ceramic substrate (1) through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part (4a) is formed by the brazing material layer which protrudes outward from a side surface of the copper circuit plate. The brazing material protrudent part (4a) includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer (4b) that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 µm 2 or less in the brazing material protrudent part (4a) is one or less (including zero).
PROCESS FOR PRODUCING A CERAMIC CIRCUIT BOARD
According to one embodiment, a ceramic circuit board includes a ceramic substrate (1), a copper circuit plate (5) and a brazing material protrudent part (4a). The copper circuit plate (5) is bonded to at least one surface of the ceramic substrate (1) through a brazing material layer including Ag, Cu, and Ti. The brazing material protrudent part (4a) is formed by the brazing material layer which protrudes outward from a side surface of the copper circuit plate. The brazing material protrudent part (4a) includes a Ti phase and a TiN phase by 3% by mass or more in total, which is different from the total amount of a Ti phase and a TiN phase in the brazing material layer (4b) that is interposed between the ceramic substrate and the copper circuit plate. The number of voids each having an area of 200 µm 2 or less in the brazing material protrudent part (4a) is one or less (including zero).
PROCESS FOR PRODUCING A CERAMIC CIRCUIT BOARD
VERFAHREN ZUR HERSTELLUNG EINER KERAMIKLEITERPLATTE
PROCÉDÉ DE FABRICATION D'UNE CARTE DE CIRCUIT CÉRAMIQUE
KATO HIROMASA (author)
2018-11-07
Patent
Electronic Resource
English
| European Patent Office | 2021
| European Patent Office | 2021