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Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board
A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 μm. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.
Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board
A ceramic circuit substrate and power module with excellent heat cycle resistance characteristics, which is formed by bonding a ceramic substrate and a copper plate via a brazing material including Ag, Cu, and an active metal, wherein the bond void fraction is no greater than 1.0% and the diffusion distance of the Ag, which is a brazing material component, is 5-20 μm. Also, a method for manufacturing a ceramic circuit substrate characterized in that the heating time in a temperature range 400-700° C. in a process for raising the temperature to a bonding temperature is 5-30 minutes and bonding is performed by maintaining the bonding temperature at 720-800° C. for 5-30 minutes.
Ceramic circuit board, method for manufacturing ceramic circuit board, and module using ceramic circuit board
HARADA YUSAKU (author) / YUASA AKIMASA (author) / NAKAMURA TAKAHIRO (author) / MORITA SHUHEI (author) / NISHIMURA KOUJI (author)
2022-09-20
Patent
Electronic Resource
English
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