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High-solid-content photosensitive silicon carbide ceramic slurry for 3D printing and preparation method of high-solid-content photosensitive silicon carbide ceramic slurry
The invention discloses high-solid-phase-content photosensitive silicon carbide ceramic slurry for 3D printing and a preparation method of the high-solid-phase-content photosensitive silicon carbide ceramic slurry. The silicon carbide ceramic slurry comprises the following components in percentage by mass: 75-85% of silicon carbide ceramic powder, 15-25% of an organic resin mixture and 1-10% of a sintering aid. The organic resin mixture comprises the following components in parts by mass: 80-95 parts of organic resin, 4-8 parts of a composite initiator and 1-6 parts of a composite dispersant. The photosensitive silicon carbide ceramic slurry is uniformly dispersed, the solid phase content of the slurry is several times that of traditional ceramic slurry, and compact silicon carbide ceramic is easier to sinter. Meanwhile, the viscosity of the slurry is only 2000-20000 mPa.S, the requirement of a common 3D printer for the viscosity of the slurry is completely met, and the problem that due to the fact that the solid phase content of photosensitive silicon carbide ceramic slurry for 3D printing is not high, direct light curing forming cannot be achieved through the 3D printing technology at present is successfully solved.
本发明公开了一种3D打印用高固相含量光敏碳化硅陶瓷浆料及其制备方法。本发明的碳化硅陶瓷浆料包括以质量百分比计的碳化硅陶瓷粉体75～85％，有机树脂混合物15～25％，烧结助剂1～10％。有机树脂混合物包括以质量份数计的有机树脂80～95份，复合引发剂4～8份，复合分散剂1～6份。本发明的光敏碳化硅陶瓷浆料分散均匀，其固相含量是传统陶瓷浆料的数倍，更易烧结出致密的碳化硅陶瓷。同时浆料粘度仅为2000～20000mPa·S，完全符合普通3D打印机对浆料粘度的要求，成功解决了目前由于3D打印用光敏碳化硅陶瓷浆料固相含量不高，无法用3D打印技术直接光固化成型的难题。
High-solid-content photosensitive silicon carbide ceramic slurry for 3D printing and preparation method of high-solid-content photosensitive silicon carbide ceramic slurry
The invention discloses high-solid-phase-content photosensitive silicon carbide ceramic slurry for 3D printing and a preparation method of the high-solid-phase-content photosensitive silicon carbide ceramic slurry. The silicon carbide ceramic slurry comprises the following components in percentage by mass: 75-85% of silicon carbide ceramic powder, 15-25% of an organic resin mixture and 1-10% of a sintering aid. The organic resin mixture comprises the following components in parts by mass: 80-95 parts of organic resin, 4-8 parts of a composite initiator and 1-6 parts of a composite dispersant. The photosensitive silicon carbide ceramic slurry is uniformly dispersed, the solid phase content of the slurry is several times that of traditional ceramic slurry, and compact silicon carbide ceramic is easier to sinter. Meanwhile, the viscosity of the slurry is only 2000-20000 mPa.S, the requirement of a common 3D printer for the viscosity of the slurry is completely met, and the problem that due to the fact that the solid phase content of photosensitive silicon carbide ceramic slurry for 3D printing is not high, direct light curing forming cannot be achieved through the 3D printing technology at present is successfully solved.
本发明公开了一种3D打印用高固相含量光敏碳化硅陶瓷浆料及其制备方法。本发明的碳化硅陶瓷浆料包括以质量百分比计的碳化硅陶瓷粉体75～85％，有机树脂混合物15～25％，烧结助剂1～10％。有机树脂混合物包括以质量份数计的有机树脂80～95份，复合引发剂4～8份，复合分散剂1～6份。本发明的光敏碳化硅陶瓷浆料分散均匀，其固相含量是传统陶瓷浆料的数倍，更易烧结出致密的碳化硅陶瓷。同时浆料粘度仅为2000～20000mPa·S，完全符合普通3D打印机对浆料粘度的要求，成功解决了目前由于3D打印用光敏碳化硅陶瓷浆料固相含量不高，无法用3D打印技术直接光固化成型的难题。
High-solid-content photosensitive silicon carbide ceramic slurry for 3D printing and preparation method of high-solid-content photosensitive silicon carbide ceramic slurry
一种3D打印用高固相含量光敏碳化硅陶瓷浆料及其制备方法
ZHAO ZHE (author) / WANG ZHENGHAO (author) / XING BOHANG (author)
2021-10-15
Patent
Electronic Resource
Chinese
IPC:
C04B
Kalk
,
LIME
/
B33Y
ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
,
Additive (generative) Fertigung, d. h. die Herstellung von dreidimensionalen [3D] Bauteilen durch additive Abscheidung, additive Agglomeration oder additive Schichtung, z. B. durch 3D- Drucken, Stereolithografie oder selektives Lasersintern
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