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Preparation method of wide-temperature high-capacity chip ceramic dielectric capacitor
The invention discloses a method for preparing a wide-temperature high-capacity chip ceramic dielectric capacitor, and the method comprises the following steps: preparing nano barium titanate-based powder with a 'shell-core' structure, mixing the nano barium titanate-based powder with an organic solvent, a dispersing agent, a plasticizer, a defoaming agent and a slurrying agent to prepare high-rheological-property tape casting slurry, and then performing tape casting treatment to prepare a dielectric film; preparing a capacitor chip, carrying out dielectric film printing lamination treatment to form blocks, carrying out lamination treatment on the blocks to form a capacitor green sheet, carrying out high-temperature glue removal and high-temperature sintering on the capacitor green sheet to form a capacitor ceramic chip, covering a nickel layer and a tin layer on the surface, carrying out sorting after a reliability test, and packaging qualified products. The prepared wide-temperature high-capacity chip ceramic dielectric capacitor has the advantages of being high in application reliability in a severe environment, high in stability, chip-type, low in cost and small in size.
本发明公开一种宽温大容量片式瓷介电容器的制备方法，依次通过具有“壳‑芯”结构的纳米钛酸钡基粉体的制备，将纳米钛酸钡基粉体混合有机溶剂、分散剂、增塑剂、除泡剂和成浆剂制备成高流变特性流延浆料，然后流延处理制成介质膜，并通过介质膜印刷叠层处理成巴块，巴块经层压处理成电容生片，然后电容生片经过高温排胶、高温烧结成电容瓷片，最后经过表面覆盖镍层和锡层，在经过可靠性试验后进行分选，将合格的产品包装，本发明制得的宽温大容量片式瓷介电容器具有在恶劣环境下应用可靠性高，具有高稳定、片式化、低成本和小尺寸的优点。
Preparation method of wide-temperature high-capacity chip ceramic dielectric capacitor
The invention discloses a method for preparing a wide-temperature high-capacity chip ceramic dielectric capacitor, and the method comprises the following steps: preparing nano barium titanate-based powder with a 'shell-core' structure, mixing the nano barium titanate-based powder with an organic solvent, a dispersing agent, a plasticizer, a defoaming agent and a slurrying agent to prepare high-rheological-property tape casting slurry, and then performing tape casting treatment to prepare a dielectric film; preparing a capacitor chip, carrying out dielectric film printing lamination treatment to form blocks, carrying out lamination treatment on the blocks to form a capacitor green sheet, carrying out high-temperature glue removal and high-temperature sintering on the capacitor green sheet to form a capacitor ceramic chip, covering a nickel layer and a tin layer on the surface, carrying out sorting after a reliability test, and packaging qualified products. The prepared wide-temperature high-capacity chip ceramic dielectric capacitor has the advantages of being high in application reliability in a severe environment, high in stability, chip-type, low in cost and small in size.
本发明公开一种宽温大容量片式瓷介电容器的制备方法，依次通过具有“壳‑芯”结构的纳米钛酸钡基粉体的制备，将纳米钛酸钡基粉体混合有机溶剂、分散剂、增塑剂、除泡剂和成浆剂制备成高流变特性流延浆料，然后流延处理制成介质膜，并通过介质膜印刷叠层处理成巴块，巴块经层压处理成电容生片，然后电容生片经过高温排胶、高温烧结成电容瓷片，最后经过表面覆盖镍层和锡层，在经过可靠性试验后进行分选，将合格的产品包装，本发明制得的宽温大容量片式瓷介电容器具有在恶劣环境下应用可靠性高，具有高稳定、片式化、低成本和小尺寸的优点。
Preparation method of wide-temperature high-capacity chip ceramic dielectric capacitor
一种宽温大容量片式瓷介电容器的制备方法
LI RUI (author) / GAO PANSONG (author) / GUO JUNPO (author) / HUANG HAO (author) / LI FEI (author) / ZHANG MENGXI (author) / WANG LIPING (author)
2022-01-18
Patent
Electronic Resource
Chinese
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