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Forming method of ceramic microchannel, ceramic microchannel material and application
The invention discloses a forming method of a ceramic microchannel, a ceramic microchannel material and application, and relates to the technical field of ceramic materials. The forming method of the ceramic microchannel comprises the following steps of: carrying out mold pressing on a green body raw material to form a ceramic green body with a microchannel structure, and packaging and sintering the ceramic green body in sequence; wherein the packaging process comprises the following steps of: coating the surface of the ceramic green body with a ceramic solder, and performing cold isostatic pressing under the condition of 100-200MPa after the ceramic solder is dried. According to the preparation method, the ceramic green body with the micro-channel structure is formed through mold pressing firstly, then the ceramic green body is packaged and sintered in sequence, the density of a matrix can be remarkably increased through cold isostatic pressing during packaging, subsequent sintering densification is facilitated, and a product with higher density is formed. The ceramic solder is adopted, so that the material of the solder and the material of the green body belong to the same material, and the problem of poor corrosion resistance and high temperature resistance caused by different materials is avoided.
本发明公开了陶瓷微通道的成形方法、陶瓷微通道材料及应用，涉及陶瓷材料技术领域。陶瓷微通道的成形方法包括：将坯体原料进行模压以形成具有微通道结构的陶瓷坯体，将陶瓷坯体依次进行封装和烧结；其中，封装的过程包括：将陶瓷焊料涂覆于陶瓷坯体表面，待干燥后在100‑200MPa的条件下进行冷等静压。通过采用先进行模压形成具有微通道结构的陶瓷坯体，再将陶瓷坯体依次进行封装和烧结，在封装时通过冷等静压能够显著增加基体的密度，有利于后续的烧结致密化，形成致密度更高的产品。通过采用陶瓷焊料使焊料的材质与坯体材料属于同类材质，避免了使用不同材质导致的耐腐蚀和耐高温性能差的问题。
Forming method of ceramic microchannel, ceramic microchannel material and application
The invention discloses a forming method of a ceramic microchannel, a ceramic microchannel material and application, and relates to the technical field of ceramic materials. The forming method of the ceramic microchannel comprises the following steps of: carrying out mold pressing on a green body raw material to form a ceramic green body with a microchannel structure, and packaging and sintering the ceramic green body in sequence; wherein the packaging process comprises the following steps of: coating the surface of the ceramic green body with a ceramic solder, and performing cold isostatic pressing under the condition of 100-200MPa after the ceramic solder is dried. According to the preparation method, the ceramic green body with the micro-channel structure is formed through mold pressing firstly, then the ceramic green body is packaged and sintered in sequence, the density of a matrix can be remarkably increased through cold isostatic pressing during packaging, subsequent sintering densification is facilitated, and a product with higher density is formed. The ceramic solder is adopted, so that the material of the solder and the material of the green body belong to the same material, and the problem of poor corrosion resistance and high temperature resistance caused by different materials is avoided.
本发明公开了陶瓷微通道的成形方法、陶瓷微通道材料及应用，涉及陶瓷材料技术领域。陶瓷微通道的成形方法包括：将坯体原料进行模压以形成具有微通道结构的陶瓷坯体，将陶瓷坯体依次进行封装和烧结；其中，封装的过程包括：将陶瓷焊料涂覆于陶瓷坯体表面，待干燥后在100‑200MPa的条件下进行冷等静压。通过采用先进行模压形成具有微通道结构的陶瓷坯体，再将陶瓷坯体依次进行封装和烧结，在封装时通过冷等静压能够显著增加基体的密度，有利于后续的烧结致密化，形成致密度更高的产品。通过采用陶瓷焊料使焊料的材质与坯体材料属于同类材质，避免了使用不同材质导致的耐腐蚀和耐高温性能差的问题。
Forming method of ceramic microchannel, ceramic microchannel material and application
陶瓷微通道的成形方法、陶瓷微通道材料及应用
LI YANHUI (author) / YAN XINGCHEN (author) / DONG DONGDONG (author) / LU BINGWEN (author) / ZHANG XINYUE (author) / WANG YUELIANG (author) / LUO YONGHAO (author)
2022-01-21
Patent
Electronic Resource
Chinese
CMC COMPONENT HAVING MICROCHANNEL AND METHOD FOR FORMING MICROCHANNEL IN CMC COMPONENT
| European Patent Office | 2019
| European Patent Office | 2024
| European Patent Office | 2019